BASIC QUALIFICATIONS:
- Master's degree in packaging science, materials science and/or polymer science
- 2+ years of industrial experience, including direct responsibility for cross-functional team leadership and goal setting
- 2+ years of experience with characterizing, testing, and evaluating the performance of electronics manufacturing
PREFERRED SKILLS AND EXPERIENCE:
- PhD in packaging science, materials science, polymer science or chemical engineering
- Exhibit a diverse technical knowledge of materials and their use in electronics
- Fundamental and practical understanding of electronic materials, used for integrated circuit packaging (i.e., dual in-line packaging (DIP), Plastic Leaded Chip Carrier (PLCC), Small Outline Integrated Circuit Package (SOIC), Quad Flat Package (QFP), Ball Grid Array (BGA), Chip Scale Package (CSP), Bottom Terminated Component (BTC), high density 2.5D, 3D, System in package (SiP), System on chip (SOC) and Chip-on-Wafer-on-Substrate (CoWoS)), printed circuit board manufacturing and printed circuit board assembly
- Proven track record of developing new materials or processes, improving efficiencies and successfully transferring to production in a fast-paced, highly competitive electronics industry
- Experience in correlations between designs (i.e., High Frequency Simulation Software (HFSS) simulations), processing and functional testing (i.e., Vector Network Analyzer (VNA) measurements)
- Execution and interpretation experience with characterization techniques and equipment, including but not limited to: mechanical testing (i.e., wire bond, die shear and peel testing), electrical testing (i.e., split cylinder resonator) and optical inspection (i.e., Scanning Electron Microscopy/Focused Ion Beam (SEM/FIB), Energy Dispersive Spectroscopy (EDS), Computed Tomography (CT), X-ray, thermal/IR images)
- Broad understanding of failure modes in commercial products and a track record implementing corrective actions
- Familiarity with materials declarations and compliance requirements for electronic components and subassemblies
COMPENSATION AND BENEFITS:
Pay Range:
Materials Engineer/Level I: $95,000.00 - $115,000.00/per year
Materials Engineer/Level II: $110,000.00 - $130,000.00/per year
Your actual level and base salary will be determined on a case-by-case basis and may vary based on the following considerations: job-related knowledge and skills, education, and experience.
Base salary is just one part of your total rewards package at SpaceX. You may also be eligible for long-term incentives, in the form of company stock, stock options, or long-term cash awards, as well as potential discretionary bonuses and the ability to purchase additional stock at a discount through an Employee Stock Purchase Plan. You will also receive access to comprehensive medical, vision, and dental coverage, access to a 401(k) retirement plan, short and long-term disability insurance, life insurance, paid parental leave, and various other discounts and perks. You may also accrue 3 weeks of paid vacation and will be eligible for 10 or more paid holidays per year. Exempt employees are eligible for 5 days of sick leave per year.
ITAR REQUIREMENTS:
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should notify the Human Resources Department at (310) 363-6000.