Senior Electronic Packaging Engineer

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The Boeing Research & Technology is seeking a Senior Electronic Packaging Engineer to join the team at Tukwila, Washington.

At Boeing, we create the future — of mobility, autonomy, speed, endurance, space access and exploration, undersea vehicles, cybersecurity, communication and much, much more.  We connect people, products and ideas around the world.  We protect people and nations.  We explore the mysteries of the universe from seabed to space to cyberspace.  We inspire future generations of innovators, dreamers and doers.

We are Boeing Research & Technology: Boeings global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace.  We are engineers and technicians, skilled scientists and bold innovators who are designing the next generation of communication systems for commercial transport airplanes, UAVs and SatCom.  Join us and put your passion, determination, and skill to work building the future!   TheFutureIsBuiltHere  ChangeTheWorld

The Communications and Sensing Technology team is seeking an experienced microelectronic packaging engineer to be part of a team to design electronic devices and boards for communication, sensor, electronic warfare and satellite systems.  This person will lead advanced electronic packaging analysis, develop architectural approaches and detail specifications as well as conduct packaging design reviews to ensure compliance to program requirements.  Also be responsible for resolving complex issues on critical programs related to advanced packaging approaches, requirements, specifications and design. 

Position responsibilities:

• Leads analysis of customer and system requirements and development of architectural approaches and detailed specifications for various electronic products
• Leads development of high-level and detailed designs consistent with requirements and specifications
• Leads reviews of testing and analysis activity to assure compliance to requirements
• Identifies, tracks and statuses technical performance measures to measure progress and ensure compliance with requirements
• Leads activities in support of Supplier Management with make/buy recommendations and other technical services
• Coordinates engineering support throughout the lifecycle of the product
• Plans research projects to develop concepts for future product designs to meet projected requirements
• Works under minimal direction

This position is expected to be 100 onsite.  The selected candidate will be required to work onsite at the listed location.

This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.

Basic Qualifications (Required Skills/Experience):

• Bachelors Degree or higher from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
• 5+ years of experience in the field of microelectronics packaging including MCM, heterogeneous integration, 3D chip stacking, etc
• Experience with complex packaging architectures on circuit performance including speed, thermal, etc
• Experience with SWaP-C constrained electronics development
• Experience with EDA tool flow and vendor supports including but are not limited to chiplets floor-planning, interposer design, SiP optimization, physical simulation, and chiplets assembly

Preferred Qualifications (Desired Skills/Experience):

• 10+ years of related work experience or an equivalent combination of education and experience
• Experience with design, development and testing of advanced packaging techniques. This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (MCMs) and System-in-Package (SiP) for digital and RF products
• Experience with 3DIC development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical and thermal considerations
• Experience with commercial microelectronics fabrication process technologies, including standard substrates (organic, silicon and glass) and PCB manufacturing processes
• Experience with R&D project planning and reporting, team building and mentoring
• Experience in leading or supporting proposal writing teams for externally funded Contract R&D opportunities with U.S. Government customers
• Experience with performing thermal and mechanical analysis at the device, board and subassembly level 
• Active security clearance

Typical Education & Experience:

Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 9 or more years related work experience or an equivalent combination of technical education and experience (e.g. PhD+4 years related work experience, Master+7 years related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

Relocation:  
This position offers relocation based on candidate eligibility.

Drug Free Workplace:

Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.

Shift Work Statement:

This position is for 1st shift.

Union:

This is a union-represented position.

At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent.  Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.  

The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.  

The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

Pay is based upon candidate experience and qualifications, as well as market and business considerations. 

Summary pay range: $113,050.00 - $163,300.00

Equal Opportunity Employer:

Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.